 | |
| Orignal genuine | Each chip comes from the original factory |
| |
| Main products | Only make original stock |
| |
| Spot inventory | Only make original stock |
| |
| Original stock | Bom Distributio | Affordable Price |
| ： | BGA725L6E6327FTSA1 |
|---|---|
| ： | 集成电路 - 集成电路 |
| ： | Infineon |
| ： | described. The |
| ： | - |
| ： | 6-XFDFN |
| ： | YES |
| TYPE | DESCRIPTION |
| Manufacturer Part Number: | BGA725L6E6327FTSA1 |
| Rohs Code: | Yes |
| Part Life Cycle Code: | Active |
| Ihs Manufacturer: | INFINEON TECHNOLOGIES AG |
| Package Description: | BCC, |
| Reach Compliance Code: | compliant |
| HTS Code: | 8542.39.00.01 |
| Factory Lead Time: | 16 Weeks |
| Manufacturer: | Infineon Technologies AG |
| Risk Rank: | 1.61 |
| Samacsys Description: | INFINEON - BGA725L6E6327FTSA1 - RF AMP, 20DB, 1.615GHZ, 3.6V, TSLP-6 |
| JESD-30 Code: | R-XBCC-B6 |
| JESD-609 Code: | e4 |
| Length: | 1.1 mm |
| Moisture Sensitivity Level: | 1 |
| Number of Functions: | 1 |
| Number of Terminals: | 6 |
| Operating Temperature-Max: | 85 °C |
| Operating Temperature-Min: | -40 °C |
| Package Body Material: | UNSPECIFIED |
| Package Code: | BCC |
| Package Shape: | RECTANGULAR |
| Package Style: | CHIP CARRIER |
| Peak Reflow Temperature (Cel): | NOT SPECIFIED |
| Seated Height-Max: | 0.4 mm |
| Supply Voltage-Nom: | 1.8 V |
| Surface Mount: | YES |
| Telecom IC Type: | BASEBAND CIRCUIT |
| Temperature Grade: | INDUSTRIAL |
| Terminal Finish: | Gold (Au) |
| Terminal Form: | BUTT |
| Terminal Pitch: | 0.2 mm |
| Terminal Position: | BOTTOM |
| [email protected] Reflow Temperature-Max (s): | NOT SPECIFIED |
| Width: | 0.7 mm |
| |
| Orignal genuine | Each chip comes from the original factory |
| |
| Main products | Only make original stock |
| |
| Spot inventory | Only make original stock |
| |
| Original stock | Bom Distributio | Affordable Price |
1
0.3844
0.3844
10
0.3647
3.647
100
0.345
34.5
500
0.3352
167.6
1000
0.3155
315.5
